Foldable Printed Circuit Boards on Paper Substrates
Harvard University · Harvard University Press
Abstract
Abstract This paper describes several low‐cost methods for fabricating flexible electronic circuits on paper. The circuits comprise i) metallic wires (e.g., tin or zinc) that are deposited on the substrate by evaporation, sputtering, or airbrushing, and ii) discrete surface‐mountable electronic components that are fastened with conductive adhesive directly to the wires. These electronic circuits—like conventional printed circuit boards—can be produced with electronic components that connect on both sides of the substrate. Unlike printed circuit boards made from fiberglass, ceramics, or polyimides, however, paper can be folded and creased (repeatedly), shaped to form three‐dimensional structures, trimmed using…
Citation impact
- FWCI
- 20.89
- Percentile
- 100%
- References
- 44
Authors
6Topics & keywords
- Printed circuit board
- Materials science
- Electronics
- Electronic circuit
- Electronic component
- Substrate (aquarium)
- Printed electronics
- Electronic packaging