Depletion-mode Ga2O3 metal-oxide-semiconductor field-effect transistors on β-Ga2O3 (010) substrates and temperature dependence of their device characteristics
National Institute of Information and Communications Technology
Abstract
Single-crystal gallium oxide (Ga2O3) metal-oxide-semiconductor field-effect transistors were fabricated on a semi-insulating β-Ga2O3 (010) substrate. A Sn-doped n-Ga2O3 channel layer was grown by molecular-beam epitaxy. Si-ion implantation doping was performed to source and drain electrode regions for obtaining low-resistance ohmic contacts. An Al2O3 gate dielectric film formed by atomic layer deposition passivated the device surface and significantly reduced gate leakage. The device with a gate length of 2 μm showed effective gate modulation of the drain current with an extremely low off-state drain leakage of less than a few pA/mm, leading to a high drain current on/off ratio of over ten orders of magnitude.…
Citation impact
- FWCI
- 11.47
- Percentile
- 100%
- References
- 16
Authors
8- MHMasataka HigashiwakiCorresponding
National Institute of Information and Communications Technology
- KSKohei Sasaki
National Institute of Information and Communications Technology
- TKTakafumi Kamimura
National Institute of Information and Communications Technology
- MHMan Hoi Wong
National Institute of Information and Communications Technology
- DKDaivasigamani Krishnamurthy
National Institute of Information and Communications Technology
Topics & keywords
- Materials science
- Ohmic contact
- Optoelectronics
- Field-effect transistor
- Transistor
- Gate dielectric
- Molecular beam epitaxy
- Leakage (economics)
- Affordable and clean energy