articleMicroelectronics ReliabilityOct 26, 2010Closed access

Reliability challenges in 3D IC packaging technology

KNK. N. Tu

University of California, Los Angeles

Indexed incrossref

Abstract

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Citation impact

633
total citations
FWCI
23.24
Percentile
100%
References
22
Citations per year

Authors

1

Topics & keywords

Topics
Keywords
  • Electromigration
  • Microelectronics
  • Reliability (semiconductor)
  • Joule heating
  • Three-dimensional integrated circuit
  • Interconnection
  • Flip chip
  • Reliability engineering
UN Sustainable Development Goals
  • Industry, innovation and infrastructure
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