Ultralow surface recombination of c-Si substrates passivated by plasma-assisted atomic layer deposited Al2O3
Plasma (Macedonia) · Eindhoven University of Technology
Abstract
Excellent surface passivation of c-Si has been achieved by Al2O3 films prepared by plasma-assisted atomic layer deposition, yielding effective surface recombination velocities of 2 and 13cm∕s on low resistivity n- and p-type c-Si, respectively. These results obtained for ∼30nm thick Al2O3 films are comparable to state-of-the-art results when employing thermal oxide as used in record-efficiency c-Si solar cells. A 7nm thin Al2O3 film still yields an effective surface recombination velocity of 5cm∕s on n-type silicon.
Citation impact
- FWCI
- 14.57
- Percentile
- 100%
- References
- 17
Authors
5- BHBram HoexCorresponding
Plasma (Macedonia), Eindhoven University of Technology
- SBS. B. S. Heil
Plasma (Macedonia), Eindhoven University of Technology
- ELE. Langereis
Plasma (Macedonia), Eindhoven University of Technology
- MCM. C. M. van de Sanden
Plasma (Macedonia), Eindhoven University of Technology
- WMW. M. M. Kessels
Plasma (Macedonia), Eindhoven University of Technology
Topics & keywords
- Passivation
- Materials science
- Recombination
- Layer (electronics)
- Atomic layer deposition
- Plasma
- Silicon
- Deposition (geology)
- Affordable and clean energy