articleMaterials Science and Engineering R ReportsJan 1, 2006Closed access

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

YLYi LiCWC.P. Wong

Georgia Institute of Technology

Indexed incrossref

Abstract

No abstract available for this paper.

Citation impact

704
total citations
FWCI
47.15
Percentile
100%
References
70
Citations per year

Authors

2

Topics & keywords

Topics
Keywords
  • Ball grid array
  • Materials science
  • Flip chip
  • Soldering
  • Electronic packaging
  • Electrical conductor
  • Interconnection
  • Adhesive
UN Sustainable Development Goals
  • Industry, innovation and infrastructure
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