A brief review of atomic layer deposition: from fundamentals to applications
Abstract
Atomic layer deposition (ALD) is a vapor phase technique capable of producing thin films of a variety of materials. Based on sequential, self-limiting reactions, ALD offers exceptional conformality on high-aspect ratio structures, thickness control at the Angstrom level, and tunable film composition. With these advantages, ALD has emerged as a powerful tool for many industrial and research applications. In this review, we provide a brief introduction to ALD and highlight select applications, including Cu(In,Ga)Se2 solar cell devices, high-k transistors, and solid oxide fuel cells. These examples are chosen to illustrate the variety of technologies that are impacted by ALD, the range of materials that ALD can…
Citation impact
- FWCI
- 51.31
- Percentile
- 100%
- References
- 91
Authors
3- RWRichard W. Johnson
Stanford University
- AHAdam Hultqvist
Stanford University
- SFStacey F. BentCorresponding
Stanford University
Topics & keywords
- Atomic layer deposition
- Limiting
- Nanotechnology
- Materials science
- Deposition (geology)
- Layer (electronics)
- Engineering physics
- Engineering