reviewMaterials TodayMay 10, 2014HYBRID OA

A brief review of atomic layer deposition: from fundamentals to applications

Stanford University

Indexed incrossref

Abstract

Atomic layer deposition (ALD) is a vapor phase technique capable of producing thin films of a variety of materials. Based on sequential, self-limiting reactions, ALD offers exceptional conformality on high-aspect ratio structures, thickness control at the Angstrom level, and tunable film composition. With these advantages, ALD has emerged as a powerful tool for many industrial and research applications. In this review, we provide a brief introduction to ALD and highlight select applications, including Cu(In,Ga)Se2 solar cell devices, high-k transistors, and solid oxide fuel cells. These examples are chosen to illustrate the variety of technologies that are impacted by ALD, the range of materials that ALD can…

Citation impact

1,925
total citations
FWCI
51.31
Percentile
100%
References
91
Citations per year

Authors

3

Topics & keywords

Keywords
  • Atomic layer deposition
  • Limiting
  • Nanotechnology
  • Materials science
  • Deposition (geology)
  • Layer (electronics)
  • Engineering physics
  • Engineering
No related works found for this paper.

Funding