Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Electronic systems that offer elastic mechanical responses to high-strain deformations are of growing interest because of their ability to enable new biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This article introduces materials and mechanical design strategies for classes of electronic circuits that offer extremely high stretchability, enabling them to accommodate even demanding configurations such as corkscrew twists with tight pitch (e.g., 90 degrees in approximately 1 cm) and linear stretching to "rubber-band" levels of strain (e.g., up to approximately 140%). The use of…

• NS
  National Science Foundation

  Awards: 0824129, DE-FG02-07ER46453, DE-FG02-07ER46471, ECCS-0824129
• UD
  U.S. Department of Energy

  Awards: FG02-07ER46453, DE-FG02-07ER46471, DE-FG02-07ER46453, DE-FG02-, DE-FG02, FG02-07ER46471
• UO
  University of Illinois at Urbana-Champaign
• DO
  Division of Materials Research
• DO
  Division of Electrical, Communications and Cyber Systems