Ultrahigh Strength and High Electrical Conductivity in Copper
Chinese Academy of Sciences · Institute of Metal Research
Abstract
Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.
Citation impact
- FWCI
- 28.82
- Percentile
- 100%
- References
- 14
Authors
5- LLLei Lu
Chinese Academy of Sciences, Institute of Metal Research
- YSY.F. Shen
Chinese Academy of Sciences, Institute of Metal Research
- XCXianhua Chen
Chinese Academy of Sciences, Institute of Metal Research
- LQLihua Qian
Chinese Academy of Sciences, Institute of Metal Research
- KLK. LuCorresponding
Chinese Academy of Sciences, Institute of Metal Research
Topics & keywords
- Copper
- Electrical resistivity and conductivity
- Ultimate tensile strength
- Materials science
- Conductivity
- Grain boundary
- Dislocation
- Nanoscopic scale