3D Printing for the Rapid Prototyping of Structural Electronics

In new product development, time to market (TTM) is critical for the success and profitability of next generation products. When these products include sophisticated electronics encased in 3D packaging with complex geometries and intricate detail, TTM can be compromised - resulting in lost opportunity. The use of advanced 3D printing technology enhanced with component placement and electrical interconnect deposition can provide electronic prototypes that now can be rapidly fabricated in comparable time frames as traditional 2D bread-boarded prototypes; however, these 3D prototypes include the advantage of being embedded within more appropriate shapes in order to authentically prototype products earlier in the…

• NA
  National Aeronautics and Space Administration

  Award: NNX13AR17A
• TE
  Texas Emerging Technology Fund
• UO
  University of Texas at El Paso