Low power and high speed bipolar switching with a thin reactive Ti buffer layer in robust HfO2 based RRAM
Industrial Technology Research Institute · National Tsing Hua University · +1 more institution
Abstract
A novel HfO 2 -based resistive memory with the TiN electrodes is proposed and fully integrated with 0.18 mum CMOS technology. By using a thin Ti layer as the reactive buffer layer into the anodic side of capacitor-like memory cell, excellent memory performances, such as low operation current (down to 25 muA), high on/off resistance ratio (above 1,000), fast switching speed (5 ns), satisfactory switching endurance (>10 6 cycles), and reliable data retention (10 years extrapolation at 200degC) have been demonstrated in our memory device. Moreover, the benefits of high yield, robust memory performance at high temperature (200degC), excellent scalability, and multi-level operation promise its application in the…
Citation impact
- FWCI
- 24.41
- Percentile
- 100%
- References
- 7
Authors
10- HLHsuan‐Yu LeeCorresponding
Industrial Technology Research Institute, National Tsing Hua University
- PSP. S. Chen
Minghsin University of Science and Technology
- TWTong Wu
Industrial Technology Research Institute
- YSY. S. Chen
Industrial Technology Research Institute
- CCC. C. Wang
Industrial Technology Research Institute
Topics & keywords
- Resistive random-access memory
- Capacitor
- Scalability
- Non-volatile memory
- Layer (electronics)
- Tin
- Data retention
- Materials science
- Affordable and clean energy