articleMaterials Science and Engineering R ReportsJun 1, 2002Closed access

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

KZKe ZengKNK. N. Tu

University of California, Los Angeles · Semiconductor Manufacturing International (Italy) · +1 more institution

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Abstract

No abstract available for this paper.

Citation impact

1,351
total citations
FWCI
57.10
Percentile
100%
References
107
Citations per year

Authors

2

Topics & keywords

Topics
Keywords
  • Soldering
  • Reliability (semiconductor)
  • Electronic packaging
  • Reliability engineering
  • Materials science
  • Metallurgy
  • Composite material
  • Engineering
UN Sustainable Development Goals
  • Industry, innovation and infrastructure
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