articleMaterials Science and Engineering R ReportsMar 1, 2005Closed access

Interfacial reactions between lead-free solders and common base materials

TLTomi LaurilaVVVesa VuorinenJKJ.K. Kivilahti
Indexed incrossref

Abstract

No abstract available for this paper.

Citation impact

1,092
total citations
FWCI
55.58
Percentile
100%
References
85
Citations per year

Authors

3

Topics & keywords

Topics
Keywords
  • Intermetallic
  • Dissolution
  • Materials science
  • Soldering
  • Base metal
  • Metastability
  • Annealing (glass)
  • Microstructure
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