Ice‐Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement
Chinese Academy of Sciences · Shenzhen Institutes of Advanced Technology · +3 more institutions
Abstract
Owing to the growing heat removal issue of modern electronic devices, polymer composites with high thermal conductivity have drawn much attention in the past few years. However, a traditional method to enhance the thermal conductivity of the polymers by addition of inorganic fillers usually creates composite with not only limited thermal conductivity but also other detrimental effects due to large amount of fillers required. Here, novel polymer composites are reported by first constructing 3D boron nitride nanosheets (3D-BNNS) network using ice-templated approach and then infiltrating them with epoxy matrix. The obtained polymer composites exhibit a high thermal conductivity (2.85 W m(-1) K(-1)), a low thermal…
Citation impact
- FWCI
- 14.46
- Percentile
- 100%
- References
- 51
Authors
7- XZXiaoliang Zeng
Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, University of Chinese Academy of Sciences
- YYYimin Yao
Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, University of Chinese Academy of Sciences
- ZGZhengyu Gong
Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology, University of Chinese Academy of Sciences
- FWFangfang Wang
Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology
- RSRong SunCorresponding
Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology
Topics & keywords
- Materials science
- Thermal conductivity
- Composite material
- Boron nitride
- Nanosheet
- Epoxy
- Polymer
- Composite number
- Affordable and clean energy