Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

Transfer printing represents a set of techniques for deterministic assembly of micro-and nanomaterials into spatially organized, functional arrangements with two and three-dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high-performance, heterogeneously integrated functional systems, including those in flexible electronics, three-dimensional and/or curvilinear optoelectronics, and bio-integrated sensing and therapeutic devices. This article summarizes recent advances in a variety of transfer printing techniques, ranging from the mechanics and materials aspects that govern their operation to engineering features of their…

• NS
  National Science Foundation

  Awards: DE-FG02-07ER46453, DE-FG02-07ER46471, 0328162
• UD
  U.S. Department of Defense
• UD
  U.S. Department of Energy

  Awards: FG02-07ER46453, DE-FG02-07ER46471, DE-FG02-07ER46453, DE-FG02-, DE-FG02, FG02-07ER46471
• IC
  Intel Corporation
• NU
  Northwestern University
• HU
  Harvard University
• UO
  University of Illinois at Urbana-Champaign
• ND
  National Defense Science and Engineering Graduate
• MU
  Multidisciplinary University Research Initiative
• DO
  Division of Materials Research
• DO
  Division of Civil, Mechanical and Manufacturing Innovation
• AF
  Air Force Research Laboratory