Temperature-aware microarchitecture

With cooling costs rising exponentially, designing cooling solutions for worst-case power dissipation is prohibitively expensive. Chips that can autonomously modify their execution and power-dissipation characteristics permit the use of lower-cost cooling solutions while still guaranteeing safe temperature regulation. Evaluating techniques for this dynamic thermal management (DTM), however, requires a thermal model that is practical for architectural studies.This paper describes HotSpot , an accurate yet fast and practical model based on an equivalent circuit of thermal resistances and capacitances that correspond to microarchitecture blocks and essential aspects of the thermal package. Validation was…

• NS
  National Science Foundation

  Awards: 9703440, 0133634
• UO
  University of Virginia