Stretchable and Foldable Silicon Integrated Circuits
Northwestern University · University of Illinois Urbana-Champaign · +1 more institution
Abstract
We have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and "wavy" structural configurations in silicon complementary logic gates, ring oscillators, and differential amplifiers. We performed three-dimensional analytical and computational modeling of the mechanics and the electronic behaviors of these integrated circuits. Collectively, the results represent routes to devices, such as personal health monitors and other biomedical…
Citation impact
- FWCI
- 57.26
- Percentile
- 100%
- References
- 32
Authors
10- DKDae‐Hyeong KimCorresponding
Northwestern University, University of Illinois Urbana-Champaign, Sungkyunkwan University
- JAJong‐Hyun AhnCorresponding
Northwestern University, University of Illinois Urbana-Champaign, Sungkyunkwan University
- WMWon Mook ChoiCorresponding
Northwestern University, University of Illinois Urbana-Champaign, Sungkyunkwan University
- HKHoon‐Sik Kim
Northwestern University, University of Illinois Urbana-Champaign, Sungkyunkwan University
- TKTae‐Ho Kim
Northwestern University, University of Illinois Urbana-Champaign, Sungkyunkwan University
Topics & keywords
- Electronic circuit
- Wafer
- Silicon
- Materials science
- Electronics
- Integrated circuit
- Amplifier
- Semiconductor