articleApplied Thermal EngineeringAug 22, 2016HYBRID OA

Flow boiling in microchannels: Fundamentals and applications

TGTassos G. KarayiannisMMMohamed M. Mahmoud

Brunel University of London · Zagazig University

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Abstract

The rapid advances in performance and miniaturization of electronics and high power devices resulted in huge heat flux values that need to be dissipated effectively. The average heat flux in computer chips is expected to reach 2–4.5 MW/m2 with local hot spots 12–45 MW/m2 while in IGBT modules, the heat flux at the chip level can reach 6.5–50 MW/m2. Flow boiling in microchannels is one of the most promising cooling methods for these and similar devices due to the capability of achieving very high heat transfer rates with small variations in the surface temperature. However, several fundamental issues are still not understood and this hinders the transition from laboratory research to commercial applications.…

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Topics & keywords

Topics
Keywords
  • Microchannel
  • Critical heat flux
  • Miniaturization
  • Materials science
  • Boiling
  • Heat transfer
  • Heat flux
  • Refrigerant
UN Sustainable Development Goals
  • Affordable and clean energy
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