Conformality in atomic layer deposition: Current status overview of analysis and modelling

Atomic layer deposition (ALD) relies on alternated, self-limiting reactions between gaseous reactants and an exposed solid surface to deposit highly conformal coatings with a thickness controlled at the submonolayer level. These advantages have rendered ALD a mainstream technique in microelectronics and have triggered growing interest in ALD for a variety of nanotechnology applications, including energy technologies. Often, the choice for ALD is related to the need for a conformal coating on a 3D nanostructured surface, making the conformality of ALD processes a key factor in actual applications. In this work, we aim to review the current status of knowledge about the conformality of ALD processes. We describe…

• EC
  European Cooperation in Science and Technology

  Award: MP1402
• FW
  Fonds Wetenschappelijk Onderzoek
• T
  Tekes
• FC
  Finnish Centre of Excellence in Atomic Layer Deposition