Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review

The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy-based underfills are often employed in flip-chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity,…