Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic devices. To achieve the desired properties, it is necessary to obtain a better understanding of how the network formation and physical state change involved in the curing reaction affect the resultant network architecture and physical properties. However, this is not necessarily easy because of their infusibility at higher temperatures and insolubility in organic solvents. In this paper, we summarize the knowledge related to these issues which has been gathered…

• JS
  Japan Society for the Promotion of Science

  Awards: JP19H02780, JP20H02790
• JS
  Japan Science and Technology Agency

  Award: JPMJMI18A2