Scalable Polyimide‐Organosilicate Hybrid Films for High‐Temperature Capacitive Energy Storage

Abstract High‐temperature polymer dielectrics have broad application prospects in next‐generation microelectronics and electrical power systems. However, the capacitive energy densities of dielectric polymers at elevated temperatures are severely limited by carrier excitation and transport. Herein, a molecular engineering strategy is presented to regulate the bulk‐limited conduction in the polymer by bonding amino polyhedral oligomeric silsesquioxane (NH 2 ‐POSS) with the chain ends of polyimide (PI). Experimental studies and density functional theory (DFT) calculations demonstrate that the terminal group NH 2 ‐POSS with a wide‐bandgap of E g ≈ 6.6 eV increases the band energy levels of the PI and induces the…

• NN
  National Natural Science Foundation of China

  Award: 92066208