The Roadmap of 2D Materials and Devices Toward Chips
Tsinghua University · Fudan University · +9 more institutions
Abstract
Due to the constraints imposed by physical effects and performance degradation, silicon-based chip technology is facing certain limitations in sustaining the advancement of Moore's law. Two-dimensional (2D) materials have emerged as highly promising candidates for the post-Moore era, offering significant potential in domains such as integrated circuits and next-generation computing. Here, in this review, the progress of 2D semiconductors in process engineering and various electronic applications are summarized. A careful introduction of material synthesis, transistor engineering focused on device configuration, dielectric engineering, contact engineering, and material integration are given first. Then 2D…
Citation impact
- FWCI
- 22.35
- Percentile
- 100%
- References
- 462
Authors
19- ALAnhan LiuCorresponding
Tsinghua University
- XZXiaowei Zhang
Tsinghua University
- ZLZiyu Liu
Fudan University, Shanghai Fudan Microelectronics (China)
- YLYuning Li
Beijing Jiaotong University, Tsinghua University
- XPXueyang Peng
Chinese Academy of Sciences, Institute of Microelectronics, University of Chinese Academy of Sciences
Topics & keywords
- Transistor
- Integrated circuit
- Electronic circuit
- Computer science
- Digital electronics
- Process (computing)
- Electronic engineering
- Electronics
Funding
- TTencent
- NNNational Natural Science Foundation of ChinaAwards: 2022ZD0209200, 62022047, 62175219, 51821003, 51861145202, STI 2030, 2016YFA0200400, U20A20168, 62374099
- CAChinese Academy of Sciences
- TUTsinghua University
- MOMinistry of Education, India
- YIYouth Innovation Promotion Association of the Chinese Academy of SciencesAwards: 2019120, 2022ZD0209200
- BIBeijing Innovation Center for Future Chip
- YIYouth Innovation Promotion Association