reviewAdvanced MaterialsJun 7, 2024Closed access

2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

WDWen DaiYWYandong WangMLMaohua LiLCLu ChenQYQingwei Yan

Chinese Academy of Sciences · University of Chinese Academy of Sciences · +1 more institution

PubMed
Indexed incrossrefpubmed

Abstract

The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron…

Citation impact

141
total citations
FWCI
15.30
Percentile
100%
References
313
Citations per year

Authors

8

Topics & keywords

Topics
Keywords
  • Materials science
  • Boron nitride
  • Thermal conductivity
  • Graphene
  • Engineering physics
  • Thermal management of electronic devices and systems
  • Nanotechnology
  • Interface (matter)
UN Sustainable Development Goals
  • Affordable and clean energy
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