Self-organized Electrical Nanostructure of DND  in Multi  -Layered  Nanostructures Espatterning

Note: In nanoelectronics technology, special parameters and systems must be used to perform such processes. For example, in the metal marking process, it is inevitable to use copper metal instead of the common aluminum metal for internal connections between different practical parts. But the rapid penetration of Cu atoms under Si during heat treatment leads to the formation of a copper silicide layer and ultimately causes the destruction of the electronic component. To solve this problem, they usually use an intermediate layer of retarding materials such as Ta and w or Mo as a penetration barrier to improve the thermal stability of the Si/Cu layer . In the characterization of nanoparticles and Si/Ta/Cu…