Thermal interface materials: From fundamental research to applications
Southern University of Science and Technology · Shenzhen Academy of Robotics
Abstract
Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering problem—a heat death problem called in semiconductor industry. A comprehensive examination of interfacial thermal resistance has been given from physics perspective in 2022 in Review of Modern Physics . Here, we provide a detailed overview from a materials perspective, focusing on the optimization of structure and compositions of thermal interface materials (TIMs) and the interact/contact with heat source and heat sink. First, we discuss the impact of…
Citation impact
- FWCI
- 17.09
- Percentile
- 100%
- References
- 263
Authors
8- BWBaojie WeiCorresponding
Southern University of Science and Technology
- WLWenmei Luo
Southern University of Science and Technology
- JDJianying Du
Southern University of Science and Technology
- YDYafei Ding
Southern University of Science and Technology
- YGYanjiang Guo
Southern University of Science and Technology
Topics & keywords
- Interface (matter)
- Thermal
- Materials science
- Engineering physics
- Process engineering
- Engineering
- Physics
- Thermodynamics