Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling
Carnegie Mellon University · Oregon State University
Abstract
Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a…
Citation impact
- FWCI
- 19.98
- Percentile
- 100%
- References
- 31
Authors
16Topics & keywords
- Materials science
- Interfacial thermal resistance
- Thermal grease
- Thermal management of electronic devices and systems
- Thermal resistance
- Composite number
- Temperature cycling
- Thermal
- Affordable and clean energy