articleMaterials HorizonsJan 1, 2025Closed access

Scalable assembly of micron boron nitride into high-temperature-resistant insulating papers with superior thermal conductivity

MLMeng-Xin LiuRMRui‐Yu MaZWZhixing WangZLZhuoyang LiGSGuilin Song

Sichuan University · Nanjing University of Aeronautics and Astronautics

PubMed
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Abstract

And an excellent thermostability with an initial decomposition temperature of 486 °C. This outstanding comprehensive performance demonstrates the promise of applying these m-BN@ANF papers in advanced electrical systems operating under high-temperature circumstances.

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42
total citations
FWCI
16.79
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100%
References
70
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Authors

11

Topics & keywords

Topics
Keywords
  • Miniaturization
  • Materials science
  • Boron nitride
  • Thermal conductivity
  • Reliability (semiconductor)
  • Nitride
  • Optoelectronics
  • Nanotechnology
UN Sustainable Development Goals
  • Affordable and clean energy
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