Recent advances in polymer-based composites for thermal management and electromagnetic wave absorption

With the rapid development of electronic technology and the integration of electronic chips, electromagnetic wave pollution and thermal management have become two critical issues hindering the growth of electronic equipment. Traditional polymer-based electronic packaging materials have very low thermal conductivity and almost no electromagnetic wave absorption ability. Therefore, the development of polymer-based composites with efficient electromagnetic wave absorption and thermally conductive performances is currently a hot research topic in the field of microelectronic packaging. At present, the addition of thermally conductive and dielectric (magnetic) fillers to the polymer matrix is an effective way to…