Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links
Columbia University · Dartmouth College · +3 more institutions
Abstract
Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities by leveraging vast distributed networks of advanced semiconductor chips. However, a barrier for AI scaling is the disproportionately high energy and chip area required to transmit data between the chips. Here we present a solution to this long-standing overhead through dense three-dimensional (3D) integration of photonics and electronics. With 80 photonic transmitters and receivers occupying a combined chip footprint of only 0.3 mm2, our platform achieves an order-of-magnitude-greater number of 3D-integrated channels than prior demonstrations. This enables both high-bandwidth (800 Gb s−1) and highly efficient,…
Citation impact
- FWCI
- 39.57
- Percentile
- 100%
- References
- 43
Authors
13- SDStuart DaudlinCorresponding
Columbia University
- ARAnthony Rizzo
Dartmouth College, United States Air Force Research Laboratory, U.S. Air Force Research Laboratory Information Directorate, Columbia University
- SLSunwoo Lee
Cornell University
- DKDevesh Khilwani
Cornell University
- COChristine Ou
Cornell University
Topics & keywords
- Photonics
- Bandwidth (computing)
- Optoelectronics
- 3D optical data storage
- Materials science
- Computer science
- Telecommunications
- Affordable and clean energy