reviewMaterials TodayMar 30, 2025Closed access

Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications

ZLZihao LinZSZhijian SunWFWenbin FuYLYu-Chieh LinKMKyoung‐sik Moon

Georgia Institute of Technology

Indexed incrossref

Abstract

No abstract available for this paper.

Citation impact

46
total citations
FWCI
18.38
Percentile
100%
References
105
Citations per year

Authors

6

Topics & keywords

Topics
Keywords
  • Materials science
  • Filler (materials)
  • Composite material
  • Epoxy
  • Electrical conductor
  • Electrically conductive
  • Electronic packaging
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