Advancing Thermal Management Technology for Power Semiconductors through Materials and Interface Engineering
University of California, Los Angeles
Abstract
, hundreds of times higher than digital electronics, posing significant thermal management challenges. Addressing this issue requires advanced materials and interface engineering, alongside a comprehensive understanding of materials physics, chemistry, transport dynamics, and various electronic, thermal, and mechanical properties. Despite progress in thermal management solutions, the complex interplay of phonons, electrons, and their interactions with material lattices, defects, boundaries, and interfaces presents persistent challenges. This Account highlights key advancements in thermal management for power semiconductors and chips, with a focus on our group's recent contributions. Our approach addresses…
Citation impact
- FWCI
- 20.78
- Percentile
- 100%
- References
- 56
Authors
6Topics & keywords
- Interface (matter)
- Engineering physics
- Thermal management of electronic devices and systems
- Semiconductor
- Power (physics)
- Materials science
- Thermal
- Engineering