articleJournal of Material Science and TechnologyJun 14, 2025Closed access

Fabrication of metastable nanoscale Ag–Cu supersaturated solid solutions and their low-temperature low-pressure interconnect applications

YZYuxin ZhangYFYangbin FangQCQian ChenSZShangjin ZhangMWMing Weng

Guangdong University of Technology

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Abstract

No abstract available for this paper.

Citation impact

43
total citations
FWCI
24.66
Percentile
100%
References
39
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Authors

9

Topics & keywords

Topics
Keywords
  • Metastability
  • Fabrication
  • Nanoscopic scale
  • Materials science
  • Supersaturation
  • Interconnection
  • Nanotechnology
  • Copper interconnect
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