The impact of Ni and Zn doping on the stability, electrical and thermal conductivity of intermetallic compounds between Sn solder and Cu substrate
Shanghai University of Engineering Science · Shanghai Jiao Tong University · +1 more institution
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Abstract
No abstract available for this paper.
Citation impact
43
total citations
- FWCI
- 24.54
- Percentile
- 100%
- References
- 42
Citations per year
Authors
8- XWXinyu Wang
Shanghai University of Engineering Science
- JCJieshi ChenCorresponding
Shanghai University of Engineering Science, Shanghai Jiao Tong University
- XHXiao He
Shanghai University of Engineering Science
- MLMeng Lin
Shanghai University of Engineering Science
- ZHZhixin Hou
Shanghai University of Engineering Science
Topics & keywords
Topics
Keywords
- Intermetallic
- Soldering
- Materials science
- Electrical resistivity and conductivity
- Substrate (aquarium)
- Metallurgy
- Thermal conductivity
- Doping
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