Hybrid AI–Taguchi–ANOVA Approach for Thermographic Monitoring of Electronic Devices

Defects in printed circuit boards (PCBs), if not detected promptly, may persist over time until they cause the failure of critical components. Traditional monitoring methods, which are limited to simulations or superficial measurements, obstruct predictive maintenance and real-time fault detection. To address these issues and enhance real-time diagnostics of thermal anomalies in PCBs, this work proposes an integrated system that combines infrared thermography (IRT), artificial intelligence (AI) algorithms, and Taguchi–ANOVA statistical techniques. IR thermography was employed to identify thermal stresses in the devices during normal operation. The IR acquisitions were used to build a dataset for specialized AI…