Effect of ultrasound-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-Foam Co/Cu soldered joints: Experiments and first-principles calculations
Xiamen University of Technology · State Key Laboratory of Advanced Brazing Filler Metals and Technology · +3 more institutions
Indexed incrossref
Abstract
No abstract available for this paper.
Citation impact
8
total citations
- FWCI
- 79.05
- Percentile
- 100%
- References
- 58
Too recent for citation history.
Authors
4- JZJiamin Zhang
Xiamen University of Technology
- LZLiang ZhangCorresponding
State Key Laboratory of Advanced Brazing Filler Metals and Technology, Xiamen University of Technology, Zhengzhou Institute of Machinery
- YCYuhao Chen
Jinhua Polytechnic, Xiamen University of Technology
- HWHui Wang
Zhejiang Institute of Special Equipment Inspection
Topics & keywords
Topics
Keywords
- Microstructure
- Intermetallic
- Scanning electron microscope
- Electron backscatter diffraction
- Soldering
- Transmission electron microscopy
- Ultrasonic sensor
- Grain size
No related works found for this paper.