articleAerospace Science and TechnologyJan 14, 2026Closed access

Bridging a Cu layer enables decent metallurgical bonding for wire-arc directed energy deposited Mg-Ti bimetals

QHQifei HanJCJiayuan CuiMFMing FanYZYu ZhengSYShuijun Ye

Beijing Institute of Technology

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5
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FWCI
38.45
Percentile
100%
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54
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8

Topics & keywords

Topics
Keywords
  • Bimetal
  • Intermetallic
  • Microstructure
  • Bimetallic strip
  • Indentation hardness
  • Ternary operation
  • Layer (electronics)
UN Sustainable Development Goals
  • Affordable and clean energy
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