Progress and prospects of thermally conductive/flame-retardant integrated polymer composites

With the rapid development of modern electronics such as AI chips and new‐energy batteries, the continuously increasing heat flux density and stringent safety requirements impose severe demands on polymer-based electronic packaging materials. However, conventional polymers inherently exhibit low thermal conductivity, which limits their ability to dissipate heat efficiently. Moreover, the inherently flammability of polymer can induce fire disaster under thermal runaway, short circuit or external ignition. This review provides a comprehensive overview of recent advances in thermally conductive and flame‐retardant integrated polymer composites. Emphasis is placed on the structural optimization and spatial…