Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

ABSTRACT Current research on integrated circuits and power electronics is rapidly advancing toward miniaturization, high power density, and multi‐chip integration, which presents unprecedented challenges to the thermal management performance of packaging materials. Along the device‐to‐sink heat‐flow path in power modules, thermal management relies primarily on two functional material systems: substrate materials that provide mechanical support and electrical insulation, and thermal interface materials (TIMs) that bridge heat transfer across heterogeneous interfaces. This paper summarizes recent advances in thermal management materials for power electronics, with a focus on ceramic‐based substrate systems,…

• NN
  National Natural Science Foundation of China

  Award: 52473330
• BN
  Beijing Nova Program

  Award: 20230484280