Copper electrodeposition in the presence of guar or activated polyacrylamide

In the copper electrodeposition industry, it is essential to dose very small concentrations of additives including chloride ions to control the physical and chemical properties of the copper deposit. It is also widely recognized in the industry that the adsorption of these additives at electrode surfaces significantly influences the currentpotential relationships. This thesis presents the development of a new organic additive for copper electrowinning and electrorefining. This thesis also presents the comparison between the new organic additive ‘activated polyacrylamide’ and Guartec (Guar), the industry-standard organic additive for electrowinning under industrial conditions. The first half of the thesis…