IT

IEEE Transactions on Components and Packaging Technologies

Journal

Institute of Electrical and Electronics Engineers

1,508

Publications

41,327

Citations

Loading papers...

Search by keywords

Filter by Type

Article (1,455)
Paratext (34)
Editorial (15)
Review (3)
Erratum (1)

Filter by Open Access Type

Open Access (63)
Closed Access (1,445)

Filter by Authors

Michael Pecht (73)
C.P. Wong (30)
J.W. McBride (23)
Avram Bar‐Cohen (20)
Bahgat Sammakia (19)

Filter by Topics

Electronic Packaging and Soldering Technologies (606)
3D IC and TSV technologies (345)
Heat Transfer and Optimization (206)
Electrical Contact Performance and Analysis (131)
Adhesion, Friction, and Surface Interactions (89)